Samsung Starts Mass-Production Of Exynos 7 Dual (7270) Processor
Samsung announced that the company has begun the mass production of the Exynos 7 Dual 7270. The Korean company said that it’s the first mobile application processor in the industry designed specifically for wearable devices, using 14-nanometer (nm) FinFET process technology. The SoC also packs in LTE support (Cat.4 LTE 2CA modem). That means your next smartwatch could connect to a cell network and also let you tether your laptop without a smartphone — a trick that’s reserved for LG Urbane LTE and just a few other wearables right now.
The chip uses several different fabrication technologies, namely package-in-package and system-in-package, with the fun acronym SiP-ePoP. This helped engineers squeeze in the DRAM, and NAND flash as well as power management chips, while minimizing the total height, to boot. It also jammed Bluetooth, WiFi, an FM radio and a GPS (GNSS) receiver into the 100 millimeter square (0.155 square inch) device. Overall, it is 20 percent more power efficient than last-generation 28-nanometer technology, Samsung says
Samsung hasn’t stated when the chip is likely to appear in any products, but low-power smartwatches and fitness bands are the likely target market. To expedite development, Samsung released a reference development platform that contains the processor, NFC chip, and the other important sensory components found in the wearable devices, that’s immediately available for device manufacturers and developers.
Samsung Exynos 7 Dual 7270 specifications:
|Specifications||Exynos 7 Dual 7270|
|CPU||Dual-core ARM Cortex–A53 processor @ up to 1.0 GHz|
|Storage||eMMC 5.0, SD card interfaces|
|Display||Up to 960×540 (qHD) resolution|
|Camera||Up to 5MP pixel sensor support|
|LTE Modem||LTE Category 4 non-CA|
|Multimedia||HD (720p@30fps) video with HEVC, H.264, VP8 Codec|
|Connectivity||WiFi, Bluetooth 4.2, FM Radio|
|PMIC||Integrated in SiP-ePoP package|
|GNSS||GPS, GLONASS, BeiDou|
|Package||SiP-ePoP, 10x10mm (SiP: System-in-Package; ePoP: embedded Package-on-Package)|