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Samsung Starts Mass-Production Of Exynos 7 Dual (7270) Processor

Samsung announced that the company has begun the mass production of the Exynos 7 Dual 7270. The Korean company said that it’s the first mobile application processor in the industry designed specifically for wearable devices, using 14-nanometer (nm) FinFET process technology. The SoC also packs in LTE support (Cat.4 LTE 2CA modem). That means your next smartwatch could connect to a cell network and also let you tether your laptop without a smartphone — a trick that’s reserved for LG Urbane LTE and just a few other wearables right now.

samsung-exynos-7-dual-7270
Exynos 7270

The chip uses several different fabrication technologies, namely package-in-package and system-in-package, with the fun acronym SiP-ePoP. This helped engineers squeeze in the DRAM, and NAND flash as well as power management chips, while minimizing the total height, to boot. It also jammed Bluetooth, WiFi, an FM radio and a GPS (GNSS) receiver into the 100 millimeter square (0.155 square inch) device. Overall, it is 20 percent more power efficient than last-generation 28-nanometer technology, Samsung says

Samsung hasn’t stated when the chip is likely to appear in any products, but low-power smartwatches and fitness bands are the likely target market. To expedite development, Samsung released a reference development platform that contains the processor, NFC chip, and the other important sensory components found in the wearable devices, that’s immediately available for device manufacturers and developers.

Samsung Exynos 7 Dual 7270 specifications:

Specifications Exynos 7 Dual 7270
CPU Dual-core ARM Cortex–A53 processor  @ up to 1.0 GHz
Memory   LPDDR3 support
GPU  ARM Mali-T720
Storage   eMMC 5.0, SD card interfaces
Display Up to 960×540 (qHD) resolution
Camera Up to 5MP pixel sensor support
LTE Modem LTE Category 4 non-CA
Multimedia HD (720p@30fps) video with HEVC, H.264, VP8 Codec
Connectivity WiFi, Bluetooth 4.2, FM Radio
PMIC Integrated in SiP-ePoP package
GNSS GPS, GLONASS, BeiDou
Package SiP-ePoP, 10x10mm (SiP: System-in-Package; ePoP: embedded Package-on-Package)